Residual stress failure and device hot light measurement experiment and numerical simulation of the electronic packaging
|School||Capital Normal University|
|Keywords||Microelectronics Packaging Residual stress 3D moire interferometry Finite Element Method|
Electronic packaging devices in the production process , will often produce thermal residual stress , and welding residual stress , and the releasing action of the residual stress and thermal deformation of the device during use , will reduce the bonding strength of the IC chip and the package body , thereby reducing the electrical performance of the integrated circuit , the repeated thermal cycling , will cause thermal fatigue failure of the device , can cause severe rupture of silicon or ceramic sheet , so that the entire device destruction . To reduce the thermal stress of the device package , to improve and enhance the heating performance and reliability of the product , thermal deformation and residual stress of the IC package for analytical testing is very important and indispensable . For a detailed study of the thermal deformation of the specimen features as well as the effect of the residual stress , the wavefront interference based on the theory , design a new three-dimensional optical test system , the plane displacement of the system test based moire interferometry methods , but with the ordinary moire interferometry optical system , the specimen grating and plane mirror group formed two diffraction plane displacement fringes doubled measurement sensitivity is 2 times the ordinary moire interferometry system from the surface displacement field tests using Twyman / Green interferometer optical path . The entire system has a novel structure , easy to adjust the displacement field fringe contrast and high . In this paper, a new three-dimensional optical test system and combined with the release of blind holes and finite element numerical simulation method , thermal deformation and residual stress analysis of electronic packaging specimen F-1C master thermal deformation characteristics of the specimen , the residual stress distribution law and its impact role , find a specimen failure to provide a theoretical and experimental support for the improvement of the specimen .