Dissertation
Dissertation > Mathematical sciences and chemical > Mechanics > Solid Mechanics > Experimental stress analysis > Optical method

Residual stress failure and device hot light measurement experiment and numerical simulation of the electronic packaging

Author SunJianHai
Tutor WangWeiNing
School Capital Normal University
Course Optics
Keywords Microelectronics Packaging Residual stress 3D moire interferometry Finite Element Method
CLC O348.1
Type Master's thesis
Year 2003
Downloads 267
Quotes 1
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Electronic packaging devices in the production process , will often produce thermal residual stress , and welding residual stress , and the releasing action of the residual stress and thermal deformation of the device during use , will reduce the bonding strength of the IC chip and the package body , thereby reducing the electrical performance of the integrated circuit , the repeated thermal cycling , will cause thermal fatigue failure of the device , can cause severe rupture of silicon or ceramic sheet , so that the entire device destruction . To reduce the thermal stress of the device package , to improve and enhance the heating performance and reliability of the product , thermal deformation and residual stress of the IC package for analytical testing is very important and indispensable . For a detailed study of the thermal deformation of the specimen features as well as the effect of the residual stress , the wavefront interference based on the theory , design a new three-dimensional optical test system , the plane displacement of the system test based moire interferometry methods , but with the ordinary moire interferometry optical system , the specimen grating and plane mirror group formed two diffraction plane displacement fringes doubled measurement sensitivity is 2 times the ordinary moire interferometry system from the surface displacement field tests using Twyman / Green interferometer optical path . The entire system has a novel structure , easy to adjust the displacement field fringe contrast and high . In this paper, a new three-dimensional optical test system and combined with the release of blind holes and finite element numerical simulation method , thermal deformation and residual stress analysis of electronic packaging specimen F-1C master thermal deformation characteristics of the specimen , the residual stress distribution law and its impact role , find a specimen failure to provide a theoretical and experimental support for the improvement of the specimen .

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