Application Study and Storey Stress Analysis on the Synchronous Crushed Stone Bonding Layer for Bridge Deck Pavement
|Course||Road and Railway Engineering|
|Keywords||Asphalt Concrete Deck The synchronous chip bonding layer Load stress Temperature stress The interlayer work state Fatigue life Fracture mechanics Crack resistance Shear test Pull-out test Impermeability test Direct shear test Construction Technology Economic Evaluation|
Bridge Deck Overlay destruction is one of the main reasons that lead to the bridge deck pavement disease, contact between the pavement and bridge deck bonding state is more complex, both the bond strength of the adhesive layer material layer, there are also The friction resistance between the concrete aggregate and the bridge deck, it is very difficult to determine the stiffness or modulus of the adhesive layer. Traffic load, temperature stress, the inside of the pavement have a greater shear stress caused by the the uncertain failure surface shear deformation, or shear capacity due to poor adhesion between the pavement and bridge deck layer, the level of anti- weaker in the horizontal direction relative displacement so that the shear failure. Shear failure is a direct result of the infiltration of harmful substances, the size of the infiltration speed during the use of the bridge deck pavement cracks size disposable adhesive layer is to prevent the infiltration of harmful substances to the last line of defense of the bridge deck, which analyzes stick The junction layer mechanical control indicators, and material properties applied research to prevent the bridge deck pavement disease has a very important practical significance. In this paper, asphalt concrete pavement surface form, disease investigation, analysis of the relationship of the disease and the adhesive layer, the proposed synchronous chip as the superiority of Asphalt Concrete Bridge Deck Overlay. The use of finite element theory, with the help of ANSYS means of synchronous chip bonding layer load stress analysis of the system; based on the differences of the bridge deck pavement temperature stress and road surface temperature stress to calculate the stress change of the temperature of the the synchronous chip bonding layer . Using the theory of fracture mechanics analysis of synchronous pavement crack resistance of the adhesive layer to calculate the fatigue life of the adhesive layer; indoor shear test, drawing test, impermeability pilot study to determine the synchronous chip bonding selection requirements of asphalt, gravel and asphalt spreading quantity range, the construction process reference. Consolidated its mechanical state of the direct shear test indicators, recommended interlayer; comprehensive comparative analysis of the construction of technical, economic, social, and other waterproof adhesive layer to draw the synchronization gravel asphalt concrete bridge deck pavement The adhesive layer with excellent value for money and the most broad application prospects. The content of this study include the following aspects: 1, the application of finite element theory Decks mechanical analysis, stress range of different bridge types of asphalt concrete bridge deck pavement. Systematic and in-depth analysis the a synchronous chip bonding interlayer load, temperature variation of the stress. 2, the application of fracture mechanics deck pavement and the bonding layer crack resistance and fatigue performance calculated. When the structure layer in wheel load and temperature under stress is less than the ultimate tensile strength obtained cracking fatigue life of a load cracking stress and cyclic loading. 3, simulated bridge deck on the synchronous crushed stone bridge deck pavement bonding layer were shear test, pull-out test, anti-fatigue test, impermeability test, the temperature sensitivity test, quadrature analysis of test data derived : synchronous gravel as a waterproof adhesive material has good durability, impermeability, resistance to high temperature sensitivity, and strong bonding properties. 4, its performance is compared with other bonding material analyzed: the synchronous chip bonding layer shear strength, high temperature and high shear, low temperature crack the best performance, easy to meet adverse requirements of high temperature shear and low temperature cracking. Derived by direct shear test: synchronous chip bonding layer shear strength gt; coil class gt; coating; the synchronous chip bonding layer shear strength of up to 2.36Mpa; come to room temperature [τ ] = 0.60 to 0.65 MPa; high temperature [τ] = 0.30 to 0.40 MPa. 6, consolidated adhesive interlayer load stress, temperature stress, and fatigue life, asked the synchronous pavement Bridge Deck Overlay interlaminar stresses working condition: [τ] _R ≥ 0.4 Mpa; and verified by direct shear test correctness, provide a reference for the design, construction and material selection. 7, using the net present value method Five bridge deck waterproofing adhesive layer technology programs and economic comparison, considering factors such as social benefits obtained synchronous pavement as a waterproof adhesive layer when the most cost-effective, proposed synchronous chip bonding the layer application most promising.