The Development of Addition-Cured Rtv Silicone Rubber Based Insulative Thermal Conductive Adhesive
|School||Harbin Institute of Technology|
|Keywords||LED packaging Thermal plastic Silicone rubber Aluminum nitride|
In order to reduce the high-power LED package thermal resistance plus the molding room temperature vulcanizing silicone rubber-based adhesive, particle size of 4.9μm Al2O3 and 1μm ZnO and particle size of 10μm, 2.2μm, 30μm and 6μm AlN filler combination developed a silicone rubber-based insulating thermal plastic. This article by differential scanning calorimetry analysis, and thermal gravimetric analysis to determine the certain silicone oil and a vinyl silicone oil used in an amount (i.e., under certain SiH / SiVi) the optimum amount of catalyst and inhibitor, and its corresponding room temperature curing time and heated to curing temperature, in order to determine this article thermal plastic substrate component and the curing process. Using settling experiments, to compare three types of coupling agents of the choice of a filler surface treatment, to determine the optimum surface treatment of the optional fillers used herein and the corresponding surface treatment process. The steady-state heat flow method, the type and amount of filler on the thermal conductivity of thermal plastic. Γ-glycidoxypropyl trimethoxy silane and the high viscosity vinyl-modified silicone oil on the thermal plastic matrix to improve the thermal glue on the adhesive properties of the aluminum alloy in accordance with GB-T7124 (ISO4587) Tensile shear strength characterized thermal plastic adhesive strength aluminum alloy; to test finished thermal plastic viscosity. Finally, the test in accordance with ASTM D 149-09, the dielectric strength of the thermal insulation of the obtained silicone rubber base gum. The experimental findings: the subject using the ratio of the silicone rubber to 10 parts of a vinyl silicone, 3.086 parts of a silicone oil, and 0.05 parts of a platinum catalyst inhibitor 0.025 parts, to ensure the operation time of the silicone rubber at room temperature for 15h, when heated to 78.8 ° C and can be quickly cured. KH-550, A-171 and ND-42, three kinds of coupling agent, the effect of surface treatment of the filler as used herein for the KH-550 is preferably, ND-42, followed by, A-171 worst, since the molecules of the KH-550 in the presence of-NH2 cause poisoning of the catalyst of platinum, so that the silicone rubber can not be cured, so this topic selected Universal ND-42 as a filler surface treatment agent. Surface treatment can significantly improve the thermal conductivity of the corresponding thermal plastic filler before and after surface treatment, thermal plastic 10μmAlN filled the highest thermal conductivity of 1.752W / m · K and 1.823W / m · K, 2.2μmAlN filling thermal plastic respectively the highest thermal conductivity of 1.512W / m · K and 1.523W / m · K. The surface-treated Al 2 O 3 , ZnO and 30μmAlN filler when used alone, the obtained thermal plastic limit of thermal conductivity were 1.327 W / m · K, 1.021 W / m · K and 1.202 W / m · K. Of 40 parts 10μmAlN and 10 parts 2.2μmAlN when used in combination, a synergistic effect, thermal plastic thermal conductivity of 1.87W / m · K; synergistic effect appears when the 40 parts Al2O3 and 5 parts of ZnO used in combination, the thermal conductivity of the corresponding thermal plastic rate 1.036 W / m · K; the combination of 30μmAlN and 6μmAlN use and no obvious synergies. When γ-glycidoxypropyl trimethoxy silane and high viscosity vinyl silicone oil were used in an amount of 0.1 parts, and 2 parts, 40 parts 10μmAlN and the 10 parts 2.2μmAlN filled thermal glue of aluminum adhesion strength reached 1.056MPa , a viscosity of 52000 mPa · s. 40 10μmAlN and 10 were filled with thermal plastic 2.2μmAlN dielectric strength is greater than 14.78kV/mm. Test results that AlN filled plus the molding room temperature vulcanizing silicone rubber-based thermal plastic has a high thermal conductivity, good electrical properties, can meet the cooling requirements of high-power LED packaging, has a good prospect of application.