Dissertation
Dissertation > Industrial Technology > Metallurgy and Metal Craft > Welding, metal cutting and metal bonding > Welding process

Reflow Soldering Process Simulation Modeling and Finite Element Analysis Based on the Analysis of the Heating Mechanism

Author SongWei
Tutor SunZhiLi
School Northeastern University
Course Mechanical Design and Theory
Keywords Lead-free Reflow soldering Simulation Temperature field SMT
CLC TG44
Type Master's thesis
Year 2012
Downloads 6
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Although the welding defects, welding quality solder joint reliability is still with the solder paste printing, placement, etc. in front of the multi-channel processes, but according to research results and production statistics show that more of welding flaws from the reflow process itself. Reflow soldering is a solder that connect SMD or SMC with PCB by melting the solder utilize external heat source make solder reflow and solidify the solder by cooling it (while adopting the soldering paste). Reliable connection of various components is attainable when the temperature section of flow oven is setup suitably. The traditional approach of experimentally analysing production defects would be costly and virtually impossible for the temperature field model is not built homeland inside. An alternative to this approach is to derive computational and numerical models to simulate the reflow soldering process.This study is lead-free devices during reflow temperature field simulation. With ANSYS software, according to the performance of lead-free solder analysis analysis for good performance of the reflow solder temperature curve;with the heat transfer theory, we will go in the infrared reflow into a convection heating, combined with the reflow equipment of the PCAs (Printed Circuit Assemblis) the actual physical process of heating, the establishment of an infrared hot air reflow method of heat transfer model; according to the size of the reflow equipment, combined with performance products for good solder paste reflow melting temperature curve requirements, according to BGA packages, the establishment of simulation by the finite element model used in PCAs; access various parts of the reflow furnace load temperature:further PCAs reflow soldering temperature field in the dynamic simulation, the dynamic component of the overall temperature of PCAs field and more satisfied with the reflow process simulation. Based on c++and ANSYS interface technology development and flow welding temperature field analysis system, realize the integration with ANSYS, greatly simplifying its thermal analysis.

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