Dissertation > Industrial Technology > Radio electronics, telecommunications technology > Microelectronics, integrated circuit (IC) > General issues > Manufacturing process

Principal component analysis of transducer system interaction law bonding point

Author ZhangYaZuo
Tutor HanLei
School Central South University
Course Mechanical Design and Theory
Keywords Thermal Bonding Bonding parameters Transducer system Principal component analysis
Type Master's thesis
Year 2010
Downloads 99
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