Study on the Influence of Microstructure on Thermal Conductivity of High Thermal Conductivity Carbon Materials
|School||Beijing University of Chemical Technology|
|Course||Materials Physics and Chemistry|
|Keywords||high thermal conductivity carbon materials thermal conductivity microstructure C/C composite material electroless copper plating|
The microstructure of high thermal conductivity carbon materials affects the thermal conductivity greatly. Thermal conductivity is anisotropy in high thermal conductivity carbon materials in the influence of the microstructure . In the high temperature circumstance, the thermal conducted in different direction affects the destructive degree and position in high thermal conductivity carbon materials. So it is meanful for high thermal conductivity carbon materials design and study to study the thermal conductivity capability of high thermal conductivity carbon materials. In this study, the factors affecting thermal conductivity were study in the point of microstructure.The influence with the density change on the different direction thermal conductivity in high thermal conductivity carbon materials were studied , and the relation between density and different direction thermal conductivity was found . The influence of tiny hole on different direction thermal conductivity in high thermal conductivity carbon materials was study by SEM and HRTEM.The microstructure of one dimension C/C composite material was studied by optics light microscope、SEM and HRTEM. The model of Microstructure during graphitization was built . The influence of microstructure on the thermal conductivity was studied .The microstructure of high thermal conductivity graphite block、high thermal conductivity graphite flake and high thermal conductivity graphite film were studied by SEM and XRD . The influence of these microstructure on the thermal conductivity was studied .The possibility of preparing copper/carbon composite material with several high thermal conductivity materials were studied by the study of high thermal conductivity material microstructure . The infiltrative capability between the surface of carbon fiber and copper was improved by the means of electroless copper plating.