Dissertation
Dissertation > Industrial Technology > General industrial technology > Engineering and basic science > Engineering Mathematics > The application of probability theory, mathematical statistics > Engineering Cybernetics

Notebook Computer Quality Improvement Study Based on DOA and MTBF

Author JieMingXing
Tutor Wu;QinJianBin
School Tsinghua University
Course Industrial Engineering
Keywords DOA MTBF OEM Quality Improve
CLC TB114.2
Type Master's thesis
Year 2009
Downloads 109
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Today’s notebook industry has entered the low margin era. In the OEM manufacturing mode, problems of product quality increased the after-sales service costs, it brings great pressure to SMEs because of the increasing operations costs. In this paper, through analyzing the voice of customer, reverse of the process, product life distribution and the quality problems in the whole supply chain, we expect to improve the indicators of DOA and MTBF, and so improve product quality, and then reduce the operation cost and enhance the competitive of enterprise.Based on statistical data of the indicators of DOA and analysis of the DOA process profile, comprehensive using of quality management tools, we have done the hypothesis testing, cause-and-effect analysis, contrastive demonstrating, simulation tracing test, drop off test and other methods in order to analyze and verify the influencing factors on the indicator of DOA, combined with the packaging dynamics and quality-cost analysis, this paper put forward the concrete measures and methods to improve the indicator of DOA.This paper analyzed and summarized the time-characteristics data of quality, and established the weibull life model of notebook computer. On the basis of improving cause-and-effect analysis of MTBF and statistical analysis of the classified maintenance data, then it further analyzes the major quality characteristics factor of MTBF. For the manufacturing process of motherboard and the characteristics of failure mode analysis, we put forward that bad components and unhealthy welding of components are the two major factors of influencing the indicator of MTBF. According to the early failure problem of weibull life model, we evaluate the two methods of improving MTBF: extending the time of the high-temperature aging filter and reducing the failure rate of components. Finally, we discuss qulity problem in the supply chain and put forward the analysis and improvement measures of unhealthy welding problem of the motherboard components.With the application of DOA improvement methods in this paper, the notebook’s DOA indicators will be improved significantly.These measures of prolonging to run in time and dotting control chart management methods in order to enhance welding quality have been carried out on the T9 new type notebook.

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